TEF 2024 – Day 1 Agenda

Keynote Presentation 

“AI-Centric Datacenters and their Diverse Network Requirements”

Ram Huggahalli, Microsoft

Principal Hardware Engineer

Strategic Planning & Architecture

“The State of Today’s Industry SDO’s and MSA’s”

Join us as we hear what Industry SDO’s and MSA’s are defining for today’s state of the art 200 Gb/s signaling and how it will apply to 400 Gb/s signaling

Moderator: John D’Ambrosia, Ethernet Alliance TEF Event Chair

Participants

• Mark Nowell, IEEE P802.3dj Vice-Chair (Cisco) – “The State of IEEE P802.3dj”
  
• Nathan Tracy, OIF President (TE) – “OIF Addresses The Paths To Next Generation AI”
  
• Uri Elzur, UEC – “Ultra Ethernet Consortium (UEC) overview – solving the AI/HPC Scale-Out Network Challenge”
  
• Tom Palkert, SNIA-SFF – “Batten Down the Hatches, 400Gb/s Signaling is coming for AI”
  
• Bijan Nowroozi, Chief Technology Officer, Open Compute Project Foundation –“The Open Compute Project (OCP) Open Systems for AI Initiative: Towards Open Systems for AI”

“The Future of Ethernet, Networks and AI”

Join industry experts in exploring how Ethernet, networking, and AI will intersect in the future.

Moderator: Sameh Boujelbene, Dell’Oro

Participants:

• Jiri Chaloupka, Cisco – “Ethernet based network for AI in 2024+”
• Xiang He, Huawei – “Is Ethernet Good Enough for AI?”
• Jeff Hutchins, OIF Board Member (Ranovus) – “Considerations for next generation AI compute interconnect”
• Chris Blackburn, Astera Labs – “Role of Ethernet in the Next Generation AI System Architectures”

Keynote Presentation

“The Future of Networking for AI in Hyperscale data centers”

Moray McLaren, Google

Principal Engineer

“Exploration of AI Interconnect”

Interconnect will define the challenges that the future of signaling must overcome to enable the AI networks of tomorrow.  This panel will delve into some of these issues.

Moderator: Lisa Huff, Omdia

Participants:

• Ashika Pandankeril Shaji, TE – “400Gbps Per Channel Pluggable IO Interface Signal Integrity Challenges And Design Considerations”
• Guangcan Mi, Huawei -“How to provide sufficient connectivity for AI a system level perspective”
• Halil Cirit, Meta -“Exploring Alternative FEC Techniques for 400G Performance Enhancement”
• Cathy Liu, OIF Board Member (Broadcom) – Performance analysis at 400+Gbps over next generation VSR channels”