Technology Exploration Forum

The AI Future: Ethernet

The Ethernet Alliance is hosting a two-day Technology Exploration Forum (TEF), “The AI Future: Ethernet”, on October 7-8, 2026, at the Hyatt Centric in Mountain View, CA. AI networks aren’t just moving toward Ethernet — they’re converging on it at every layer of scale. Scale‑up, scale‑out, scale‑across, wherever AI architectures are expanding, Ethernet is winning the battle.

And the market signals are unmistakable. Industry analysts now project that cumulative Ethernet switching spend over the next five years will surge to a half trillion dollars. Not because demand is uncertain — but because demand is so intense that supply may be the only limiting factor.

Sustaining this trajectory requires more than momentum. It demands continued development of robust, interoperable Ethernet standards capable of supporting AI’s next wave of scale, complexity, and performance.

IEEE 802.3 has already begun work on 400 Gb/s electrical and optical signaling, but the exploration cannot stop there. The Ethernet Alliance invites the community to help shape what comes next. Your insights, research, and innovations will help define the standards, technologies, and architectures that carry AI into the future.

Join the Ethernet Alliance as we chart the next evolution of Ethernet for AI.

Topics of Interest

The Technology Exploration Forum is an opportunity for individuals to present and share their ideas with members of the Ethernet community interested in exploring the future of Ethernet. Potential topics for discussion and presentations include but are not limited to:

AI Networks Market Forecast
Next‑generation scale‑up, scale‑out, and scale‑across architectures
The Need for Beyond 1.6 Tb/s Ethernet
The Consequences of the Physical Layer on the AI Network Stack
Future Requirements of Network Equipment Targeting AI Use Cases
Future Requirements of Compute Equipment Targeting AI Use Cases
Latency requirements of AI Networks

Advanced modulations for 400 Gb/s electrical signaling
Developments in Copper Interconnect / Packaging Targeting 400 Gb/s
Developments in Optical Interconnect/Packaging Targeting 400 Gb/s
FEC / Coding Approaches
The future of optical fiber
Power & Cooling Considerations
Testing & methodologies

Call for Presentations

The Technology Exploration Forum is open to the Ethernet community. Please submit the following information for your proposal for a panel or presentation.

Proposal Format (one page):
Title (not more than 5 or 6 words)
Photograph of Presenter
Abstract
Short biography of the presenter & contact information (job title, address, telephone, email)
Brief description of the presenters’ organization

Please note proposals for product overviews will not be accepted. All proposals should be emailed to TEF@ethernetalliance.org no later than June 3, 2026.

All proposals will be reviewed and acceptance notifications will be provided on July 1, 2026. Panels based on complementary proposals may be organized.

Intended Audience

Chief Technologists
Hyperscale Data Center Architects
AI Network Experts
Compute and Network Architects
System Engineers
Packaging Engineers
Electrical Signaling Integrity Experts
Optical Signaling Experts
DSP Engineers
Electrical / Optical Component Engineers

Interconnect Providers
Optical Module Manufacturers
Networking Marketing
Solution providers & consultants
Data Center Power Engineers
Physical Layer Test Engineers
Design Software Experts
Network Performance Measurement Engineers

Sponsorship Opportunities

Does your company want to sponsor one of the biggest Ethernet events of 2026? The Ethernet Alliance is offering multiple different sponsorship opportunities for those companies looking to get involved in the “The AI Future – Ethernet” TEF. If your company is interesting in being a sponsor, you can view the sponsorship opportunities here or contact morgan@ethernetalliance.org.

Contact Information

Email TEF@ethernetalliance.org

c/o Ethernet Alliance | 3855 SW 153rd Drive | Beaverton, OR 97006 | 503.619.0564