TEF 2026 – Day 2 Agenda

Thursday, October 8th, 2026

“IMDD Optics For AI”

IM‑DD optical technologies have long anchored Ethernet’s optical ecosystem, but AI’s relentless demand for bandwidth is now pushing IM‑DD to its limits in the next wave of AI data‑campus buildouts. Join this panel to hear industry leaders deliver fresh insights, breakthrough developments, and the forward paths shaping Ethernet’s future.

Moderator: Vlad Kozlov, LightCounting

Participants:

• • Maxim Kuschernov, Huawei – Technical feasibility of 1.6Tb/s FR4-2km
  • Roberto Rodes, Coherent – Challenges and Requirements for Future 400G/Lane PAM4 WDM Optical Links
  • Brian Welch, Cisco – Optics for 400GPL Scale Up
  • Jeff Hutchins, Ranovus – Developing AI Optical Interconnect Standards on the AI Timeline

“The Future of Coherent Ethernet for AI”

As AI data‑campus buildouts surge, the demand for high‑bandwidth, long‑reach optical connections is accelerating — and traditional approaches are hitting their limits. Coherent Ethernet is emerging as the breakthrough technology poised to meet these requirements. Join this panel to explore the promise of Coherent Ethernet and how it can address the scaling challenges ahead.

Moderator: Lisa Huff, DC Tech Analysis

Participants:

• • Tom Issenhuth, Huawei – Coherent Optics in AI infrastructure
  • Gary Nicholl, Cisco – Considerations on coherent optical solutions for 1.6Tb/s Ethernet
  • Eric Maniloff, Ciena – Coherent Ethernet for AI applications
  • Marco Mascitto, Nokia – Scale-across for AI super-clusters

PENDING

Presenter: Adrian Motamedi, Microsoft

“Approaches to Next Generation Optical Packaging”

Advances in optical packaging and form factors are accelerating at a dizzying pace as the industry races to meet AI’s escalating performance demands. This panel will examine the diverse approaches, innovations, and strategic directions shaping the next generation of optical interconnection.

Moderator: Jon Pugh, OPTICA

Participants:

• • Guangcan Mi, Huawei – Re-locating optics in the 400G signaling AI data center
  • Andy Becholsheim, Arista – XPO pluggable optics modules
  • Hesham Taha, Molex – Optical interconnects for deployment in CPO based infrastructure
  • Ramin Farjadrad, Eliyan – Going Slow and Wide in Optics
    

“The Future Challenges of Testing for AI Networks”

As industry races to solve AI’s staggering bandwidth demands, the test community faces an equally urgent challenge: staying ahead of a technology curve that is accelerating faster than ever. This panel brings together leading experts to examine the emerging obstacles, evolving methodologies, and new strategies required to validate the AI networks of tomorrow.

Moderator: David Rodgers, Ethernet Alliance President

Participants:

• • Kevin Mammenga, Wilder Technologies – Early Thoughts on Compliance Test Fixtures in a 448G CPO/NPO Environment
  • Paul Brooks, Viavi Solutions – T&M and a saleable ecosystem
  • John Calvin, Keysight – Test and Measurement Innovations for 448G