TEF 2026 – Day 1 Agenda

“IEEE 802.3 Update – Ethernet for AI Related Activities”

The IEEE 802.3 Ethernet Working Group is driving a bold exploration into how Ethernet must evolve to power the next generation of AI‑optimized networks. Join this panel to hear industry leaders share the newest insights, breakthroughs, and directions shaping Ethernet’s future.

Moderator: John D’Ambrosia, Huawei

Participants:

• • Kent Lusted, Synopsys
  • David O’Felt, HPE
  • Mabud Choudhury, Genuine Optics

“Evolving Infrastructure Challenges in the Age of AI”

Presenter: Rob Stone, META

“Challenges of Electrical Signaling @ 400 Gb/s Signaling”

400 Gb/s electrical signaling over copper is igniting a new wave of innovation across interconnect architectures, advanced modulation schemes, and next‑generation FEC. Join leading industry voices as they unpack the breakthroughs reshaping high‑performance connectivity and reveal what’s coming next.

Moderator: Lisa Huff, DC Tech Analysis

Participants:

• • Ashika Pandankeril Shaji, TE Connectivity -400G/Lane PAM4 Copper Interconnects for AI: Signal Integrity, Channel Feasibility and Reach Extension
  • Xiang He, Huawei – PAM4 vs. PAM6 Revisited: Do Measured Channels and Improved FEC Change the Outcome?
  • Cathy Liu, Broadcom – 448G Requires a System Design Paradigm Shift
  • Sam Kocsis, Amphenol – Defining Copper Cable Channels at 448G

“Scale-up and Scale-out, how large planar networks are impacting optical density in the Data Center”

Presenter: Brian Rhoney, Corning

“The Challenges of Optical Infrastructure for AI’s Future”

While the industry is buzzing about AI’s scale‑up, scale‑out, and scale‑across architectures, a bigger question looms: can the underlying fiber infrastructure scale fast enough to sustain AI’s explosive bandwidth growth? Join top industry leaders as they dive into the challenges, opportunities, and breakthroughs shaping the next era of optical connectivity.

Moderator: Alan Weckel, 650 Group

Participants:

• • Earl Parsons, CommScope – Parallel Fibers in Ethernet Networks and AI Factories
  • Bob Wagner, Panduit – Designing Optical Networks for Density and Scalability
  • Vince Ferretti, Corning

“Lessons learned from GW-scale AI deployments”

Presenter: Mark Filer, Oracle

“The State of Industry Development for Multi-core Fiber”

As AI drives unprecedented scale, the underlying network infrastructure becomes mission‑critical — and every element is now under scrutiny, including the very fiber that ties these networks together. This panel will dive into multi‑core fiber: its promise, its emerging applications, and the transformative potential it brings to next‑generation AI connectivity.

Moderator: Alan Weckel, 650 Group

Participants:

• • Jose Castro, Panduit – Multicore Fiber Supporting the Scale of Ethernet AI Networks: From polarity methods to Lane Breakouts
  • Vince Ferretti, Corning – MCF Technology Status and Standardization Landscape
  • Rang-Chen Yu, Terahop – Multicore fiber optical transceivers for AI Scaling
  • Earl Parsons, CommScope – Multicore Fiber’s Role in Ethernet Networks and AI Factories