Tom Palkert – SNIA-SFF

Bio: Thomas Palkert has done architecture/definition and design of high speed SERDES and optical modules for data center, AI, telecom, storage, military and consumer products. He has been involved in many standardization efforts including Ethernet, Fibre channel, Infiniband, VESA, SFF/SNIA and the OIF. His current work focuses on high speed electrical and optical interfaces for 100G to 1.6Tbit applications.  Tom is a Senior member of the IEEE, a past member of the OIF board of directors, past chair of the OIDA silicon photonics alliance and is currently chair of the Fibre Channel T11.2 Physical Layer Task Group, and chair of the SNIA SFF (Small Form Factor) transceiver group. He is also the editor of the OIF CEI-112G-Linear specification.

Presentation Abstract: 400Gb Ethernet is coming for AI aboard the SFF Technical Work Group. The SNIA/SFF Technical Work Group (SFF TA TWG) develops specifications for connectors, cables and modules that are used in AI applications. In this presentation, we will show how the SFF development of specifications for 200Gb have given insight into developing 400Gb in a faster, more efficient manner. With faster speeds come tighter and tighter mechanical tolerances. You will hear how new specifications that have been developed to support 200Gb could also be used to “batten down the hatches” for developing 400Gb Ethernet SFF specs which in turn will be used for the most efficient AI interconnects available. These interconnects include passive copper cables (DAC), active copper cables (ACC) and optical interconnects all using the same form factor. The SFF TA TWG includes industry suppliers across the entire ecosystem working together to provide optimal solutions for the AI industry with expertise in mechanical design, signal integrity, management interfaces, and optical requirements.